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TP0606N3-G-P002 - Microchip

Description: MOSFET P-CH Enhancmnt Mode MOSFET

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TP0606N3-G-P002 - Microchip - PCB symbol
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TP0606N3-G-P002 - Microchip PCB footprint - Other - Other - TO-92 (N3)
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TP0606N3-G-P002 - Microchip - 3D model - Other - TO-92 (N3)
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TP0606N3-G-P002 Details

  • Manufacturer Part Number:

    TP0606N3-G-P002

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    3

  • Manufacturer Package Code:

    TO-92-3

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    0.32 A

  • Drain-source On Resistance-Max:

    3.5 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    35 pF

  • JEDEC-95 Code:

    TO-92

  • JESD-30 Code:

    O-PBCY-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    CYLINDRICAL

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    1 W

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    BOTTOM

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

TP0606N3-G-P002 Frequently Asked Questions (FAQs)

  • Microchip recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a dedicated heat sink.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines. Additionally, consider using thermal interface materials (TIMs) to improve heat transfer between the device and the heat sink or PCB. Operating the device within its specified temperature range and avoiding overheating will also help ensure reliability.
  • Exceeding the maximum junction temperature (Tj) rating can lead to reduced device lifespan, increased thermal resistance, and potentially even device failure. It's crucial to ensure that the device operates within its specified temperature range to maintain reliability and performance.
  • The TP0606N3-G-P002 has built-in ESD protection, but it's still essential to follow proper ESD handling procedures during manufacturing, assembly, and testing. This includes using ESD-safe materials, grounding personnel, and using ESD-protective packaging and storage.
  • Microchip recommends following the JEDEC J-STD-020D.1 standard for soldering conditions. The recommended peak reflow temperature is 260°C, with a maximum time above 255°C of 30 seconds. It's essential to follow these guidelines to ensure reliable solder joints and prevent damage to the device.

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TP0606N3-G-P002 Overview

Use the download button to access the TP0606N3-G-P002 schematic symbol, PCB footprint, and 3D model.
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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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