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TP2104K1-G - Microchip

Description: P-Channel 40 V 160mA (Tj) 360mW (Ta) Surface Mount TO-236AB (SOT23)

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PCB Footprints
TP2104K1-G - Microchip PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - 3-Lead TO-236AB (SOT-23)
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3D Models
TP2104K1-G - Microchip  - 3D model - SOT23 (3-Pin) - 3-Lead TO-236AB (SOT-23)
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TP2104K1-G Details

  • Manufacturer Part Number:

    TP2104K1-G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    2.90 X 1.30 MM, 1.12 MM HEIGHT, GREEN PACKAGE-3

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT-23-3

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    5 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Additional Feature:

    LOW THRESHOLD

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    0.16 A

  • Drain-source On Resistance-Max:

    6 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    10 pF

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation Ambient-Max:

    0.36 W

  • Power Dissipation-Max (Abs):

    0.36 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

TP2104K1-G Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer. This helps to dissipate heat efficiently. Additionally, ensure that the thermal pad is connected to a large copper area to improve heat dissipation.
  • To ensure reliable operation in high-temperature environments, ensure that the device is operated within the recommended temperature range (–40°C to +125°C). Also, consider using a heat sink or thermal interface material to improve heat dissipation. Finally, follow proper PCB design and layout guidelines to minimize thermal resistance.
  • To prevent damage, handle the device by the body and avoid touching the pins or leads. Use an anti-static wrist strap or mat to prevent electrostatic discharge (ESD) damage. Also, avoid bending or flexing the leads, and use a vacuum pickup or tweezers to handle the device during assembly.
  • To troubleshoot issues with the device, start by reviewing the application circuit and ensuring that it is designed according to the datasheet recommendations. Check for proper power supply voltage, decoupling, and layout. Use a logic analyzer or oscilloscope to monitor the device's signals and identify any anomalies. Consult the datasheet and application notes for troubleshooting guidelines.
  • For high-reliability or safety-critical applications, consider using redundant circuits or redundant devices to ensure continued operation in the event of a failure. Implement fail-safe mechanisms, such as watchdog timers or reset circuits, to detect and respond to device failures. Additionally, follow industry-specific guidelines and standards, such as IEC 61508 or DO-254, to ensure compliance with safety and reliability requirements.

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TP2104K1-G Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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Small Signal Field-Effect Transistor, 0.16A I(D), 40V, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, TO-236AB