SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Seated Height-Max:
1.2 mm
Supply Current-Max:
12 mA
Supply Voltage-Max (Vsup):
5.5 V
Supply Voltage-Min (Vsup):
4.5 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
INDUSTRIAL
Terminal Finish:
NICKEL PALLADIUM GOLD
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Width:
4.4 mm
TPA0172PWPG4 Frequently Asked Questions (FAQs)
Texas Instruments provides a recommended PCB layout in the datasheet, which includes guidelines for component placement, trace routing, and thermal management. It's essential to follow these guidelines to ensure optimal performance and thermal dissipation.
The gain setting depends on the input signal level and the desired output power. The TPA0172PWPG4 has a gain range of 6 dB to 26 dB. You can use the gain calculation formula provided in the datasheet to determine the correct gain setting for your application.
The maximum power dissipation of the TPA0172PWPG4 is dependent on the ambient temperature and the thermal resistance of the PCB. According to the datasheet, the maximum power dissipation is 2.5 W at 25°C ambient temperature. However, this value can be derated based on the thermal resistance of the PCB.
Yes, the TPA0172PWPG4 can be used in a bridged configuration to increase the output power. However, this requires careful consideration of the power supply voltage, output impedance, and thermal management. Texas Instruments provides guidelines for bridged configurations in the datasheet.
The TPA0172PWPG4 has built-in overvoltage protection (OVP) and undervoltage protection (UVP) circuits. However, it's still recommended to add external protection circuits, such as voltage regulators and TVS diodes, to ensure robust protection against voltage transients and faults.
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TPA0172PWPG4 Overview
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
