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TPA0223DGQR - Texas Instruments

Description: 2-W Mono Audio Power Amp with Headphone Drive

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PCB Footprints
TPA0223DGQR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGQ (S-PDSO-G10)
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3D Models
TPA0223DGQR - Texas Instruments  - 3D model - Small Outline Packages - DGQ (S-PDSO-G10)
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TPA0223DGQR Details

  • Manufacturer Part Number:

    TPA0223DGQR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    10

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    CLASS AB AUDIO AMPLIFIER

  • Gain:

    20 dB

  • Harmonic Distortion:

    1%

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    2 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    15 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

TPA0223DGQR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the TPA0223DGQR datasheet, but it's also important to follow general high-frequency PCB design guidelines, such as keeping the audio signal traces short and away from noise sources, using a solid ground plane, and decoupling the power supply lines.
  • The gain setting depends on the input signal level and the desired output power. The TPA0223DGQR has a gain range of 6 dB to 26 dB. A higher gain setting can provide more output power, but may also increase noise and distortion. A lower gain setting can provide a cleaner signal, but may not provide enough output power. It's recommended to experiment with different gain settings to find the optimal value for your specific application.
  • The maximum power dissipation of the TPA0223DGQR is dependent on the ambient temperature and the thermal resistance of the PCB. According to the datasheet, the maximum power dissipation is 2.5 W at 25°C ambient temperature. However, this value can be derated at higher temperatures. It's recommended to perform thermal analysis and simulation to ensure the device operates within its thermal limits.
  • The TPA0223DGQR has built-in EMI filtering, but additional filtering may be necessary depending on the specific application. It's recommended to use a combination of passive and active filtering techniques, such as RC filters, ferrite beads, and common-mode chokes, to filter out noise and EMI. Additionally, proper PCB layout and shielding can also help to reduce noise and EMI.
  • The TPA0223DGQR requires a well-regulated power supply with minimal ripple and noise. A recommended decoupling scheme is to use a combination of ceramic and electrolytic capacitors, with values ranging from 10 nF to 100 uF, placed close to the device's power pins. Additionally, it's recommended to use a voltage regulator with a low dropout voltage and high power supply rejection ratio (PSRR) to ensure a clean power supply.

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TPA0223DGQR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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