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TPA0233DGQ - Texas Instruments

Description: Mono Class-AB Audio Amplifier with Stereo Headphone Drive--Summed Inputs

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TPA0233DGQ - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - S-PDSO-G10-Thermal
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TPA0233DGQ - Texas Instruments  - 3D model - Small Outline Packages - S-PDSO-G10-Thermal
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TPA0233DGQ Details

  • Manufacturer Part Number:

    TPA0233DGQ

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    10

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    CLASS AB AUDIO AMPLIFIER

  • Gain:

    2.5 dB

  • Harmonic Distortion:

    1%

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Noise Figure-Nom:

    93 dB

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    2 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    5 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

TPA0233DGQ Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the TPA0233DGQ datasheet, which includes guidelines for component placement, trace routing, and grounding. Following this layout can help minimize noise, distortion, and electromagnetic interference (EMI).
  • The gain setting of the TPA0233DGQ depends on the specific requirements of your application. The datasheet provides a gain setting table that can help you determine the correct gain based on the input signal level and desired output power. You can also use the device's gain adjustment pins to fine-tune the gain setting.
  • The maximum power dissipation of the TPA0233DGQ is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 2.5 W at an ambient temperature of 25°C. However, this value can be derated at higher temperatures. It's essential to ensure proper thermal management to prevent overheating and damage to the device.
  • The TPA0233DGQ has built-in electrostatic discharge (ESD) protection, but it's still important to take precautions during handling and assembly. Use ESD-safe equipment and follow proper handling procedures to prevent damage. Additionally, consider adding external overvoltage protection devices, such as transient voltage suppressors (TVS) or zener diodes, to protect the device from voltage transients and surges.
  • The recommended input and output coupling capacitor values for the TPA0233DGQ depend on the specific application and frequency range. As a general guideline, use capacitors with a value of 1-10 μF for input coupling and 10-100 μF for output coupling. The datasheet provides more detailed information on capacitor selection and filtering.

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TPA0233DGQ Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image TPA0233DGQG4 Texas Instruments

Audio Amplifier, 2W, 2 Channel(s), 1 Func, CMOS, PDSO10