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TPA102DGNR - Texas Instruments

Description: 150-mW Stereo Audio Power Amplifier

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TPA102DGNR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGN0008D-2021
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TPA102DGNR - Texas Instruments  - 3D model - Small Outline Packages - DGN0008D-2021
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TPA102DGNR Details

  • Manufacturer Part Number:

    TPA102DGNR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    CLASS AB AUDIO AMPLIFIER

  • Gain:

    31.8 dB

  • Harmonic Distortion:

    0.1%

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    0.15 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    3 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

TPA102DGNR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the TPA102DGNR datasheet, which includes guidelines for component placement, trace routing, and thermal management. It's essential to follow this layout to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The input capacitor value depends on the input impedance of the amplifier and the desired high-pass filter cutoff frequency. A general rule of thumb is to choose a capacitor value that is at least 10 times the input impedance of the amplifier. For the TPA102DGNR, a 1-10uF capacitor is typically suitable.
  • The maximum power dissipation of the TPA102DGNR is dependent on the ambient temperature and the thermal resistance of the PCB. According to the datasheet, the maximum power dissipation is 2.5W at 25°C ambient temperature. However, this value can be derated based on the thermal resistance of the PCB and the operating temperature.
  • Yes, the TPA102DGNR can be used in a bridged configuration to increase the output power. However, this requires careful consideration of the output stage design, including the output filter components and the load impedance. Texas Instruments provides application notes and design guides for bridged amplifier configurations.
  • Common issues with the TPA102DGNR can be troubleshooted by checking the PCB layout, component values, and signal integrity. Distortion can be caused by incorrect input capacitor values, while oscillation can be caused by poor PCB layout or inadequate decoupling. Texas Instruments provides troubleshooting guides and application notes to help identify and resolve these issues.

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TPA102DGNR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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