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TPA2025D1YZGT - Texas Instruments

Description: TPA2025D1YZGT Texas Instruments, Audio Amplifier, 12-Pin DSBGA

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TPA2025D1YZGT - Texas Instruments PCB footprint - BGA - BGA - YZG_12
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TPA2025D1YZGT - Texas Instruments  - 3D model - BGA - YZG_12
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TPA2025D1YZGT Details

  • Manufacturer Part Number:

    TPA2025D1YZGT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Pin Count:

    12

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • Harmonic Distortion:

    1%

  • JESD-30 Code:

    R-PBGA-B12

  • JESD-609 Code:

    e1

  • Length:

    2.295 mm

  • Moisture Sensitivity Level:

    1

  • Noise Figure-Nom:

    97 dB

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    1.7 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA12,3X4,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.625 mm

  • Supply Current-Max:

    6 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.795 mm

TPA2025D1YZGT Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the TPA2025D1YZGT evaluation module documentation, which includes guidelines for component placement, trace routing, and thermal management to minimize noise and ensure optimal performance.
  • The input capacitor value depends on the input signal frequency and amplitude. A general rule of thumb is to choose a capacitor value that is at least 10 times the input impedance of the amplifier. For example, if the input impedance is 10kΩ, a 100nF capacitor would be a good starting point.
  • The maximum power dissipation of the TPA2025D1YZGT is dependent on the ambient temperature and the thermal resistance of the PCB. According to the datasheet, the maximum power dissipation is 2.5W at 25°C ambient temperature. However, this value can be derated based on the actual operating conditions.
  • To prevent oscillations and instability, ensure that the input and output circuits are properly decoupled, and the layout is designed to minimize parasitic inductance and capacitance. Additionally, adding a small resistor (e.g., 10Ω) in series with the input capacitor can help to dampen oscillations.
  • A recommended voltage supply decoupling scheme for the TPA2025D1YZGT is to use a 10uF ceramic capacitor in parallel with a 100nF ceramic capacitor, both connected as close as possible to the device's power pins. This helps to filter out high-frequency noise and ensure stable operation.

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TPA2025D1YZGT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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