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TPA2035D1YZFR - Texas Instruments

Description: 2.75-W Mono Class-D Audio Amplifier with Fixed Gain and Short Circuit Auto-Recovery (TPA2035)

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PCB Footprints
TPA2035D1YZFR - Texas Instruments PCB footprint - BGA - BGA - YZF0009
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TPA2035D1YZFR - Texas Instruments  - 3D model - BGA - YZF0009
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TPA2035D1YZFR Details

  • Manufacturer Part Number:

    TPA2035D1YZFR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Pin Count:

    9

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • JESD-30 Code:

    S-PBGA-B9

  • JESD-609 Code:

    e1

  • Length:

    1.79 mm

  • Moisture Sensitivity Level:

    1

  • Noise Figure-Nom:

    100 dB

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    9

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    2.75 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA9,3X3,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.625 mm

  • Supply Current-Max:

    5.7 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.79 mm

TPA2035D1YZFR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, which includes guidelines for component placement, trace routing, and thermal management. It's essential to follow these guidelines to ensure optimal performance, thermal dissipation, and EMI reduction.
  • The input capacitor values depend on the input impedance, frequency response, and noise requirements of your application. A general rule of thumb is to use a 1-10uF capacitor with a voltage rating of at least 2x the maximum input voltage. TI also provides a capacitor selection guide in the datasheet.
  • The maximum power dissipation of the TPA2035D1YZFR is dependent on the ambient temperature, PCB layout, and thermal management. According to the datasheet, the maximum power dissipation is 2.5W at 25°C ambient temperature. However, it's essential to perform thermal calculations and simulations to ensure the device operates within safe operating conditions.
  • Yes, the TPA2035D1YZFR can be used in a bridged configuration to increase the output power. However, this requires careful consideration of the output stage, power supply, and thermal management. TI provides guidelines for bridged configurations in the datasheet and application notes.
  • To reduce EMI and noise, follow proper PCB layout guidelines, use shielding, and implement filtering techniques such as ferrite beads, capacitors, and resistors. Additionally, ensure proper grounding, decoupling, and bypassing of power supplies and signals.

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TPA2035D1YZFR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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