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TPA3107D2PAPR - Texas Instruments

Description: 15-W Stereo Class-D Audio Power Amplifier (TPA3107)

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TPA3107D2PAPR - Texas Instruments PCB footprint - Quad Flat Packages - Quad Flat Packages - PAP0064N
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TPA3107D2PAPR - Texas Instruments  - 3D model - Quad Flat Packages - PAP0064N
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TPA3107D2PAPR Details

  • Manufacturer Part Number:

    TPA3107D2PAPR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFP

  • Pin Count:

    64

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bandwidth-Nom:

    22 kHz

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • Gain:

    6 dB

  • JESD-30 Code:

    S-PQFP-G64

  • JESD-609 Code:

    e4

  • Length:

    10 mm

  • Moisture Sensitivity Level:

    3

  • Noise Figure-Nom:

    102 dB

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    15 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTFQFP

  • Package Equivalence Code:

    QFP64,.47SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    26.5 mA

  • Supply Voltage-Max (Vsup):

    26 V

  • Supply Voltage-Min (Vsup):

    10 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    10 mm

TPA3107D2PAPR Frequently Asked Questions (FAQs)

  • TI recommends using a 10uF capacitor in parallel with a 100nF capacitor, placed as close as possible to the power pins, to ensure stable operation and minimize noise.
  • The gain setting depends on the specific application and desired output power. TI provides a gain setting calculator tool to help determine the optimal gain setting. Additionally, the datasheet provides a gain vs. frequency graph to help with gain selection.
  • The TPA3107D2PAPR can handle up to 20W of continuous average power and 30W of peak power. However, the actual power handling capability depends on the thermal design and heat sinking of the system.
  • Proper heat sinking, thermal design, and airflow are crucial to prevent overheating. TI recommends using a heat sink with a thermal resistance of 10°C/W or lower, and ensuring good airflow around the device.
  • TI provides a recommended PCB layout in the datasheet, which includes guidelines for component placement, trace routing, and thermal via placement to ensure optimal performance and thermal management.

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TPA3107D2PAPR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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