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TPA3117D2RHBT - Texas Instruments

Description: Texas Instruments TPA3117D2RHBT Audio Amplifier, Class-D Stereo, 32-Pin QFN

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TPA3117D2RHBT - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RHB0032E HEIGHT 1_A
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3D Models
TPA3117D2RHBT - Texas Instruments  - 3D model - Quad Flat No-Lead - RHB0032E HEIGHT 1_A
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TPA3117D2RHBT Details

  • Manufacturer Part Number:

    TPA3117D2RHBT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Pin Count:

    32

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bandwidth-Nom:

    22 kHz

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • Gain:

    21.6 dB

  • JESD-30 Code:

    S-PQCC-N32

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    2

  • Noise Figure-Nom:

    102 dB

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    15 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    50 mA

  • Supply Voltage-Max (Vsup):

    26 V

  • Supply Voltage-Min (Vsup):

    8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

TPA3117D2RHBT Frequently Asked Questions (FAQs)

  • TI recommends using a 10uF ceramic capacitor in parallel with a 100nF ceramic capacitor, placed as close as possible to the power pins (VIN and GND) to ensure stable operation.
  • Keep the power traces short and wide, use a solid ground plane, and place the input and output capacitors close to the IC. Also, ensure that the thermal pad is connected to a solid ground plane to improve heat dissipation.
  • The maximum power dissipation of the TPA3117D2RHBT is 15W, but this can be limited by the thermal resistance of the package and the PCB. Ensure proper heat sinking and thermal design to prevent overheating.
  • Yes, the TPA3117D2RHBT can be used in a bridged configuration to increase the power output. However, this requires careful design and layout considerations to ensure proper operation and thermal management.
  • Use a voltage regulator or a voltage supervisor to ensure that the supply voltage remains within the recommended operating range (8V to 26V). Also, consider adding overvoltage protection (OVP) and undervoltage protection (UVP) circuits to prevent damage from voltage transients.

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TPA3117D2RHBT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image TPA3117D2RHBR Texas Instruments

15W, 2 Channel(s), 1 Func, CMOS, PQCC32