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TPA3118D2DAP - Texas Instruments

Description: Texas Instruments TPA3118D2DAP 2-Channel Audio Amplifier IC, Class-D Mono/Stereo, 32-Pin HTSSOP

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TPA3118D2DAP - Texas Instruments - PCB symbol
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TPA3118D2DAP - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - dap(r-pdso-g32)
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TPA3118D2DAP - Texas Instruments - 3D model - Small Outline Packages - dap(r-pdso-g32)
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TPA3118D2DAP Details

  • Manufacturer Part Number:

    TPA3118D2DAP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bandwidth-Nom:

    22 kHz

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • Gain:

    36 dB

  • JESD-30 Code:

    R-PDSO-G32

  • JESD-609 Code:

    e4

  • Length:

    11 mm

  • Moisture Sensitivity Level:

    3

  • Noise Figure-Nom:

    102 dB

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    30 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP32,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    50 mA

  • Supply Voltage-Max (Vsup):

    26 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.1 mm

TPA3118D2DAP Frequently Asked Questions (FAQs)

  • TI recommends using a 10uF ceramic capacitor in parallel with a 100nF ceramic capacitor, placed as close as possible to the power pins (VIN and GND) to ensure stable operation.
  • The gain setting depends on the input signal level and the desired output power. TI provides a gain calculation formula in the datasheet. For a typical application, a gain of 20-30 dB is recommended. However, it's essential to experiment with different gain settings to find the optimal value for your specific use case.
  • The TPA3118D2DAP can handle up to 20W of continuous power per channel into a 4Ω load. However, this value can vary depending on the ambient temperature, supply voltage, and other factors. Always check the thermal and power dissipation calculations to ensure safe operation.
  • Implement thermal protection by monitoring the device temperature (TJ) and shutting down the amplifier if it exceeds 150°C. You can also use thermal pads or heat sinks to improve heat dissipation. Ensure good airflow and avoid blocking the airflow around the device.
  • Follow the recommended PCB layout guidelines in the datasheet, which include keeping the power traces short and wide, using a solid ground plane, and placing the input and output capacitors close to the device. Avoid routing sensitive analog signals near the power traces.

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TPA3118D2DAP Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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