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TPA311D - Texas Instruments

Description: 3.91mm TPA311D, Audio Amplifier Class-AB mono/stereo 1.4MHz +85°C 8-Pin SOIC

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TPA311D - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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TPA311D - Texas Instruments  - 3D model - Small Outline Packages - D0008A
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TPA311D Details

  • Manufacturer Part Number:

    TPA311D

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bandwidth-Nom:

    10 kHz

  • Consumer IC Type:

    AUDIO AMPLIFIER

  • Harmonic Distortion:

    0.5%

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    0.35 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    1.5 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

TPA311D Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the TPA311D datasheet, which includes a thermal pad connected to a large copper area on the bottom layer to dissipate heat. Additionally, it's recommended to use a 4-layer PCB with a solid ground plane to reduce electromagnetic interference (EMI).
  • The output filter design depends on the specific application and speaker impedance. A general guideline is to use a 2nd-order low-pass filter with a cutoff frequency around 50 kHz to 100 kHz. The filter components should be chosen to provide a damping factor of around 1 to 2 to ensure stability and minimize ringing.
  • The maximum power dissipation of the TPA311D depends on the ambient temperature and the thermal resistance of the PCB. According to the datasheet, the maximum power dissipation is around 20W at 25°C ambient temperature. However, this value can be derated at higher temperatures. It's essential to perform thermal analysis and simulation to ensure the device operates within the safe operating area.
  • The TPA311D has built-in overvoltage protection (OVP) and undervoltage protection (UVP) circuits. However, it's still recommended to add external protection circuits, such as a voltage supervisor or a power-on reset circuit, to ensure the device is powered up correctly and safely. Additionally, a TVS diode or a zener diode can be used to protect the device from voltage transients and spikes.
  • The recommended input capacitor value is around 10uF to 22uF, with a voltage rating of at least 25V. A low-ESR ceramic capacitor or a film capacitor is recommended due to their low equivalent series resistance (ESR) and high reliability. The input capacitor should be placed close to the device's input pins to minimize noise and ripple.

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TPA311D Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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