SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Seated Height-Max:
1.2 mm
Supply Current-Max:
37 mA
Supply Voltage-Max (Vsup):
30 V
Supply Voltage-Min (Vsup):
10 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
INDUSTRIAL
Terminal Finish:
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Width:
4.4 mm
TPA3123D2PWP Frequently Asked Questions (FAQs)
TI recommends using a 10uF capacitor in parallel with a 100nF capacitor, both connected between the power supply pins (PVDD and PVSS) and the ground pin (GND). This helps to filter out noise and ensure stable operation.
The gain setting depends on the specific application and desired output power. TI provides a gain setting formula in the datasheet, but a general rule of thumb is to start with a gain of 20dB and adjust as needed to achieve the desired output power while avoiding oscillation.
The maximum output power of the TPA3123D2PWP depends on the supply voltage and load impedance. According to the datasheet, the maximum output power is 20W per channel into a 4Ω load with a 24V supply voltage. However, this can be affected by factors such as thermal dissipation and PCB design.
To prevent overheating, ensure good thermal dissipation by using a heat sink, providing adequate airflow, and keeping the device away from other heat sources. Monitor the device temperature and adjust the power supply voltage or output power to prevent thermal shutdown.
TI provides a recommended PCB layout in the datasheet, which includes keeping the power supply traces short and wide, using a solid ground plane, and placing the decoupling capacitors close to the device. Additionally, ensure that the thermal pad is connected to a solid ground plane to aid in heat dissipation.
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TPA3123D2PWP Overview
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
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