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TPA3128D2DAP - Texas Instruments

Description: Audio Amp Speaker 1-CH Mono/2-CH Stereo 60W Class-D 32-Pin HTSSOP EP Tube

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TPA3128D2DAP - Texas Instruments - PCB symbol
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PCB Footprints
TPA3128D2DAP - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DAP (R-PDSO-G32)
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TPA3128D2DAP - Texas Instruments - 3D model - Small Outline Packages - DAP (R-PDSO-G32)
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TPA3128D2DAP Details

  • Manufacturer Part Number:

    TPA3128D2DAP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2016-12-31

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bandwidth-Nom:

    22 kHz

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • Gain:

    36 dB

  • JESD-30 Code:

    R-PDSO-G32

  • JESD-609 Code:

    e4

  • Length:

    11 mm

  • Moisture Sensitivity Level:

    3

  • Noise Figure-Nom:

    102 dB

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    30 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP32,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    26 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.1 mm

TPA3128D2DAP Frequently Asked Questions (FAQs)

  • TI recommends using a 10uF ceramic capacitor in parallel with a 100nF ceramic capacitor, placed as close as possible to the power pins (VIN and GND) to ensure stable operation.
  • The gain setting depends on the specific application requirements. TI provides a gain calculation formula in the datasheet. For a more detailed analysis, use TI's WEBENCH Filter Designer tool to simulate and optimize the gain setting for your specific use case.
  • The TPA3128D2DAP can handle up to 20W of continuous power per channel, but this depends on the thermal design and heat sinking of the PCB. Ensure proper thermal management to prevent overheating and damage to the device.
  • Use a voltage supervisor or a power-on reset circuit to monitor the supply voltage and reset the device if it falls outside the recommended operating range (4.5V to 26V). Additionally, consider using a voltage regulator to regulate the supply voltage.
  • Follow TI's recommended PCB layout guidelines, including using a solid ground plane, placing decoupling capacitors close to the power pins, and using thermal vias to dissipate heat. Ensure a good thermal connection between the device and the heat sink or PCB.

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TPA3128D2DAP Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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