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TPA3129D2DAP - Texas Instruments

Description: 2-Ch 15-W Differential Analog Input Class-D Amplifier With Low Idle Power Dissipation

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TPA3129D2DAP - Texas Instruments - PCB symbol
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TPA3129D2DAP - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DAP (R-PDSO-G32)
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TPA3129D2DAP - Texas Instruments - 3D model - Small Outline Packages - DAP (R-PDSO-G32)
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TPA3129D2DAP Details

  • Manufacturer Part Number:

    TPA3129D2DAP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2017-06-30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bandwidth-Nom:

    22 kHz

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • Gain:

    36 dB

  • JESD-30 Code:

    R-PDSO-G32

  • JESD-609 Code:

    e4

  • Length:

    11 mm

  • Moisture Sensitivity Level:

    3

  • Noise Figure-Nom:

    102 dB

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    15 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP32,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    26 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.1 mm

TPA3129D2DAP Frequently Asked Questions (FAQs)

  • TI recommends using a 10uF ceramic capacitor in parallel with a 100nF ceramic capacitor, placed as close as possible to the power pins (VIN and GND) to ensure stable operation.
  • The gain setting depends on the specific application requirements. TI provides a gain calculation formula in the datasheet. For a more detailed analysis, use TI's WEBENCH Filter Designer tool to simulate and optimize the gain setting for your specific application.
  • The TPA3129D2DAP can handle up to 20W of continuous power per channel, but this can vary depending on the specific application, PCB design, and thermal management. Always check the thermal performance and power handling in your specific design.
  • To ensure EMI compliance, follow proper PCB design practices, such as using a solid ground plane, minimizing trace lengths, and using shielding and filtering components as needed. Additionally, TI provides EMI reduction techniques in the datasheet and application notes.
  • TI provides a recommended layout and routing guide in the datasheet and application notes. Key considerations include keeping the power traces short and wide, using a solid ground plane, and minimizing signal trace lengths and crossings.

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TPA3129D2DAP Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image TPA3129D2DAPR Texas Instruments

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