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TPA3140D2PWP - Texas Instruments

Description: Inductor Free Stereo (BTL) 10W Class-D Audio Amplifier with ultra low EMI and Auto Gain Limiter

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TPA3140D2PWP - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PWP (R-PDSO-G28)
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TPA3140D2PWP - Texas Instruments  - 3D model - Small Outline Packages - PWP (R-PDSO-G28)
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TPA3140D2PWP Details

  • Manufacturer Part Number:

    TPA3140D2PWP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bandwidth-Nom:

    22 kHz

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • Gain:

    36 dB

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e4

  • Length:

    9.7 mm

  • Moisture Sensitivity Level:

    3

  • Noise Figure-Nom:

    102 dB

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    10 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP28,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    14.4 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

TPA3140D2PWP Frequently Asked Questions (FAQs)

  • TI recommends using a 10uF capacitor in parallel with a 100nF capacitor, placed as close as possible to the power pins, to ensure stable operation.
  • Keep the power traces short and wide, use a solid ground plane, and place the input and output capacitors close to the device. Avoid routing signals under the device.
  • The maximum power dissipation is dependent on the ambient temperature and the thermal resistance of the PCB. Refer to the thermal design considerations in the datasheet for more information.
  • Yes, the TPA3140D2PWP can be used in a bridged configuration, but it requires careful consideration of the output stage and power supply design to ensure stable operation.
  • Use a voltage supervisor or a power-on reset circuit to monitor the supply voltage and reset the device if it falls outside the recommended operating range.

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TPA3140D2PWP Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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