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TPA5052RSAR - Texas Instruments

Description: Stereo Digital Audio Delay Processor With Hardware Control

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PCB Footprints
TPA5052RSAR - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RSA (S-PVQFN-N16)(H=1mm)
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3D Models
TPA5052RSAR - Texas Instruments  - 3D model - Quad Flat No-Lead - RSA (S-PVQFN-N16)(H=1mm)
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TPA5052RSAR Details

  • Manufacturer Part Number:

    TPA5052RSAR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Pin Count:

    16

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Consumer IC Type:

    CONSUMER CIRCUIT

  • JESD-30 Code:

    S-PQCC-N16

  • JESD-609 Code:

    e4

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.16SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    3 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

TPA5052RSAR Frequently Asked Questions (FAQs)

  • A good PCB layout is crucial for the TPA5052RSAR. TI recommends a 4-layer PCB with a solid ground plane, and to keep the audio signal traces as short as possible. Additionally, it's essential to separate the analog and digital grounds to minimize noise and interference.
  • To ensure stability, make sure to follow the recommended component values and PCB layout. Also, add a 10nF to 100nF capacitor between the BYPASS pin and ground to filter out high-frequency noise. Additionally, use a low-ESR capacitor for the power supply decoupling.
  • The maximum power dissipation of the TPA5052RSAR is dependent on the ambient temperature and the thermal resistance of the PCB. According to the datasheet, the maximum power dissipation is 2.5W at 25°C ambient temperature. However, it's recommended to derate the power dissipation based on the actual operating conditions.
  • Yes, the TPA5052RSAR can be used in a bridged configuration to increase the output power. However, this requires careful consideration of the power supply, PCB layout, and thermal management. TI provides a bridged amplifier configuration example in the datasheet, but it's essential to follow the recommended design guidelines and simulation tools to ensure optimal performance.
  • To troubleshoot common issues, start by checking the PCB layout, component values, and power supply quality. Use an oscilloscope to measure the output signal and identify any anomalies. Also, check the device's thermal performance and ensure proper heat sinking. If issues persist, consult the TI support resources, application notes, and online forums for guidance.

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TPA5052RSAR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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