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TPA6102A2DGKR - Texas Instruments

Description: 50-mW Ultra Low-Voltage, Stereo Headphone Audio Amplifier with Fixed Gain (14dB)

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TPA6102A2DGKR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK (S-PDSO-G8) _
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TPA6102A2DGKR - Texas Instruments  - 3D model - Small Outline Packages - DGK (S-PDSO-G8) _
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TPA6102A2DGKR Details

  • Manufacturer Part Number:

    TPA6102A2DGKR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    AUDIO AMPLIFIER

  • Gain:

    14 dB

  • Harmonic Distortion:

    0.1%

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    0.05 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    1.2 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    1.6 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

TPA6102A2DGKR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the TPA6102A2DGKR evaluation module documentation, which includes guidelines for component placement, trace routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The gain setting of the TPA6102A2DGKR depends on the specific application requirements. The datasheet provides a gain setting table, and engineers can use this table to select the appropriate gain setting based on the input signal amplitude and desired output power. Additionally, the TPA6102A2DGKR evaluation module documentation provides more detailed information on gain setting selection.
  • The maximum power dissipation of the TPA6102A2DGKR is dependent on the operating conditions, such as supply voltage, output power, and ambient temperature. Engineers should refer to the datasheet for the power dissipation calculation formula and ensure proper thermal management by using a heat sink, thermal pad, or other thermal management techniques to keep the device junction temperature within the recommended operating range.
  • The TPA6102A2DGKR has built-in EMI filtering, but additional filtering may be required depending on the specific application. Engineers can use external filters, such as RC filters or ferrite beads, to filter out noise and EMI. Additionally, proper PCB layout and grounding techniques can help minimize EMI and noise in the audio circuit.
  • The recommended input and output coupling capacitor value depends on the specific application requirements, such as the input signal frequency and amplitude, and the output load impedance. A general guideline is to use a capacitor value between 1uF to 10uF, but engineers should refer to the datasheet and application notes for more specific guidance.

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TPA6102A2DGKR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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