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TPA6120A2DWP - Texas Instruments

Description: Texas Instruments TPA6120A2DWP Headphone Audio Amplifier, Class-AB Stereo 100dB, 20-Pin SOIC

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TPA6120A2DWP - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - HSOP-20_2020
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TPA6120A2DWP - Texas Instruments  - 3D model - Small Outline Packages - HSOP-20_2020
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TPA6120A2DWP Details

  • Manufacturer Part Number:

    TPA6120A2DWP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    20

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    IT CAN ALSO OPERATE WITH 10V TO 30V SINGLE SUPPLY

  • Bandwidth-Nom:

    22 kHz

  • Consumer IC Type:

    AUDIO AMPLIFIER

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e4

  • Length:

    12.825 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    1.5 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSOP

  • Package Equivalence Code:

    SOP20,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Supply Current-Max:

    15 mA

  • Supply Voltage-Max (Vsup):

    15 V

  • Supply Voltage-Min (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.52 mm

TPA6120A2DWP Frequently Asked Questions (FAQs)

  • A good PCB layout for the TPA6120A2DWP involves keeping the audio signal traces short and away from the power supply traces, using a solid ground plane, and placing the device close to the power supply decoupling capacitors. Additionally, using a shielded enclosure and minimizing the length of the input and output cables can help reduce EMI.
  • To optimize the gain setting, you need to consider the input signal level, the desired output level, and the impedance of the load. A good starting point is to set the gain to 20 dB (default) and then adjust it based on the specific requirements of your application. You can use the gain equation provided in the datasheet to calculate the optimal gain setting.
  • The TPA6120A2DWP has a thermal shutdown feature that activates when the junction temperature exceeds 150°C. To ensure reliable operation, make sure to provide adequate heat sinking, use a thermal pad or heat sink, and keep the device away from other heat sources. You should also ensure good airflow and avoid blocking the airflow around the device.
  • To filter out noise and hum, you can use a combination of passive and active filtering techniques. Use a low-pass filter at the input to remove high-frequency noise, and a high-pass filter at the output to remove DC offset and hum. You can also use a noise filter capacitor between the output and ground to reduce noise.
  • The TPA6120A2DWP has built-in ESD protection, but it's still important to take precautions during handling and assembly to prevent damage. Use an ESD wrist strap or mat, handle the device by the body or pins, and avoid touching the pins or leads. You should also use ESD-protected storage and shipping materials.

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TPA6120A2DWP Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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