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TPA6120A2DWPR - Texas Instruments

Description: Audio Amplifiers High Fidelity Stereo Headphone Drv

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TPA6120A2DWPR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DWP0020B
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TPA6120A2DWPR - Texas Instruments  - 3D model - Small Outline Packages - DWP0020B
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TPA6120A2DWPR Details

  • Manufacturer Part Number:

    TPA6120A2DWPR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    20

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    IT CAN ALSO OPERATE WITH 10V TO 30V SINGLE SUPPLY

  • Bandwidth-Nom:

    22 kHz

  • Consumer IC Type:

    AUDIO AMPLIFIER

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e4

  • Length:

    12.825 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    1.5 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSOP

  • Package Equivalence Code:

    SOP20,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Supply Current-Max:

    15 mA

  • Supply Voltage-Max (Vsup):

    15 V

  • Supply Voltage-Min (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.52 mm

TPA6120A2DWPR Frequently Asked Questions (FAQs)

  • A good PCB layout for the TPA6120A2DWPR involves keeping the audio signal traces short and away from the power supply traces, using a solid ground plane, and placing the device close to the power supply decoupling capacitors. Additionally, using a shielded enclosure and minimizing the length of the input and output cables can help reduce EMI.
  • The gain setting for the TPA6120A2DWPR depends on the specific application and the desired output power. A good starting point is to set the gain to 20 dB (Rg = 2 kΩ) and adjust from there based on the output power requirements. It's also important to consider the input impedance and output impedance of the device when setting the gain.
  • The TPA6120A2DWPR requires a well-regulated power supply with minimal ripple and noise. A recommended decoupling scheme includes a 10 μF ceramic capacitor in parallel with a 1 μF ceramic capacitor, both connected as close as possible to the device's power pins.
  • To protect the TPA6120A2DWPR from overheating, ensure good airflow around the device, use a heat sink if necessary, and avoid operating the device at maximum power for extended periods. Additionally, monitor the device's temperature and shut down the device if it exceeds the maximum operating temperature (150°C).
  • The recommended input and output coupling capacitor value for the TPA6120A2DWPR is 1 μF to 10 μF, depending on the specific application and frequency response requirements. A larger capacitor value can provide better low-frequency response, but may also increase the risk of oscillation.

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TPA6120A2DWPR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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