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TPA6130A2RTJR - Texas Instruments

Description: TEXAS INSTRUMENTS - TPA6130A2RTJR . - Audio Power Amplifier, 138 mW, AB, 2 Channel, 2.5V to 5.5V, QFN, 20 Pins

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PCB Footprints
TPA6130A2RTJR - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - S-PWQFN-N20
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3D Models
TPA6130A2RTJR - Texas Instruments  - 3D model - Quad Flat No-Lead - S-PWQFN-N20
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TPA6130A2RTJR Details

  • Manufacturer Part Number:

    TPA6130A2RTJR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Pin Count:

    20

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Consumer IC Type:

    VOLUME CONTROL CIRCUIT

  • Harmonic Distortion:

    1%

  • JESD-30 Code:

    S-PQCC-N20

  • JESD-609 Code:

    e4

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    0.138 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC20,.16SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max:

    6 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

TPA6130A2RTJR Frequently Asked Questions (FAQs)

  • According to TI's application notes, a 10uF ceramic capacitor and a 1uF ceramic capacitor in parallel, placed close to the power pins, are recommended for power supply decoupling.
  • The gain setting depends on the input signal level and the desired output power. TI recommends using the gain calculation formula provided in the datasheet, and adjusting the gain resistors accordingly.
  • The maximum power dissipation of the TPA6130A2RTJR is dependent on the ambient temperature and the thermal resistance of the PCB. TI recommends using the thermal calculation formula provided in the datasheet to determine the maximum power dissipation for a specific application.
  • TI recommends using thermal monitoring and shutdown circuitry, such as the TPS3828, to protect the TPA6130A2RTJR from overheating. Additionally, ensuring good thermal design and heat sinking can help prevent overheating.
  • TI recommends following the PCB layout guidelines provided in the datasheet, including using a solid ground plane, separating analog and digital grounds, and minimizing trace lengths and widths.

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TPA6130A2RTJR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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