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TPA6141A2YFFT - Texas Instruments

Description: CLASS-G DIRECTPATH STEREO HEADPHONE AMPLIFIER

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PCB Footprints
TPA6141A2YFFT - Texas Instruments PCB footprint - Other - Other - BGA16C40P4X4_156X156X63
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3D Models
TPA6141A2YFFT - Texas Instruments  - 3D model - Other - BGA16C40P4X4_156X156X63
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TPA6141A2YFFT Details

  • Manufacturer Part Number:

    TPA6141A2YFFT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Pin Count:

    16

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Consumer IC Type:

    CLASS G AUDIO AMPLIFIER

  • Gain:

    6 dB

  • Harmonic Distortion:

    10%

  • JESD-30 Code:

    S-PBGA-B16

  • JESD-609 Code:

    e1

  • Length:

    1.905 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    0.025 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA16,4X4,16

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.625 mm

  • Supply Current-Max:

    2 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.905 mm

TPA6141A2YFFT Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the TPA6141A2YFFT evaluation module documentation, which includes guidelines for component placement, trace routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The input capacitor values depend on the input signal frequency, amplitude, and source impedance. A general guideline is to use a capacitor with a value between 1uF to 10uF, with a voltage rating that exceeds the maximum input voltage. Additionally, the capacitor should have a low equivalent series resistance (ESR) to minimize power loss and ensure stability.
  • The maximum power dissipation of the TPA6141A2YFFT is dependent on the ambient temperature, PCB layout, and thermal management. The device can dissipate up to 2.5W of power. To ensure it doesn't overheat, use a heat sink, ensure good airflow, and follow the recommended PCB layout guidelines. Monitor the device temperature using the thermal pad and take corrective action if it exceeds 150°C.
  • Yes, the TPA6141A2YFFT can be used in a stereo audio application. To configure it, use two devices, one for each channel, and connect the input signals to the respective VIN+ and VIN- pins. Ensure that the gain settings and input capacitors are identical for both channels to maintain channel-to-channel matching and minimize crosstalk.
  • To troubleshoot common issues with the TPA6141A2YFFT, follow a systematic approach: 1) Verify the power supply voltage and ensure it's within the recommended range. 2) Check the input signal amplitude and frequency to ensure they're within the specified limits. 3) Verify the PCB layout and component values meet the recommended guidelines. 4) Use an oscilloscope to measure the output signal and identify any signs of oscillation or distortion. 5) Consult the datasheet and application notes for guidance on specific troubleshooting techniques.

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TPA6141A2YFFT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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