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TPA6211A1TDGNRQ1 - Texas Instruments

Description: Automotive 3.1-W Mono, Fully Differential, Class-AB Audio Amplifier

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TPA6211A1TDGNRQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGN0008D -2021
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TPA6211A1TDGNRQ1 - Texas Instruments  - 3D model - Small Outline Packages - DGN0008D -2021
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TPA6211A1TDGNRQ1 Details

  • Manufacturer Part Number:

    TPA6211A1TDGNRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    CLASS AB AUDIO AMPLIFIER

  • Harmonic Distortion:

    10%

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    3

  • Noise Figure-Nom:

    105 dB

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    3.1 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    5 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

TPA6211A1TDGNRQ1 Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the TPA6211A1TDGNRQ1 can be found in the Texas Instruments application note SLAA701, which provides guidelines for PCB layout, component placement, and thermal management.
  • The gain setting for the TPA6211A1TDGNRQ1 depends on the specific application requirements. A good starting point is to use the recommended gain setting from the datasheet, and then adjust it based on the desired output power and THD (Total Harmonic Distortion) performance.
  • The maximum power dissipation for the TPA6211A1TDGNRQ1 is dependent on the ambient temperature and the thermal resistance of the PCB. A good rule of thumb is to keep the junction temperature below 150°C to ensure reliable operation.
  • To protect the TPA6211A1TDGNRQ1 from ESD and overvoltage, it is recommended to use TVS (Transient Voltage Suppressor) diodes and a voltage regulator to regulate the supply voltage. Additionally, ensure that the PCB is designed with ESD protection in mind, such as using ESD-resistant components and following proper PCB layout guidelines.
  • The recommended thermal management strategy for the TPA6211A1TDGNRQ1 involves using a heat sink, thermal interface material, and ensuring good airflow around the device. The thermal resistance of the PCB should also be minimized by using thermal vias and a thermal pad.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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