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TPA701D - Texas Instruments

Description: 700-mW Mono, Class-AB Audio Amplifier

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TPA701D - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D(R-PDSO-G)
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TPA701D Details

  • Manufacturer Part Number:

    TPA701D

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bandwidth-Nom:

    4 kHz

  • Consumer IC Type:

    AUDIO AMPLIFIER

  • Harmonic Distortion:

    0.5%

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    0.7 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    0.25 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

TPA701D Frequently Asked Questions (FAQs)

  • According to TI's application notes, a 10uF ceramic capacitor in parallel with a 100nF ceramic capacitor is recommended for power supply decoupling to ensure stable operation and minimize noise.
  • TI recommends following a star-grounding approach, keeping the power supply traces away from the audio signal traces, and using a solid ground plane to minimize EMI and noise. Additionally, placing the input and output capacitors close to the device can help reduce noise.
  • The maximum power dissipation of the TPA701D is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 2.5W at 25°C. To calculate the power dissipation, use the formula: Pd = (Vcc x Icc) + (Vout x Iout), where Vcc is the supply voltage, Icc is the quiescent current, Vout is the output voltage, and Iout is the output current.
  • Yes, the TPA701D can be used in a bridged configuration to increase the output power. To do this, connect the outputs of two devices in anti-phase, and use an external resistor to set the gain. TI provides a detailed application note on bridged amplifier configurations, including schematics and design considerations.
  • The recommended input impedance for the TPA701D is 20kΩ to 50kΩ. The input impedance affects the gain of the amplifier, with a higher input impedance resulting in a higher gain. TI provides a gain vs. input impedance graph in the datasheet to help with design calculations.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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