SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Seated Height-Max:
1.1 mm
Supply Current-Max:
0.25 mA
Supply Voltage-Max (Vsup):
5.5 V
Supply Voltage-Min (Vsup):
2.5 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
INDUSTRIAL
Terminal Finish:
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Width:
3 mm
TPA701DGN Frequently Asked Questions (FAQs)
According to TI's application notes, a 10uF ceramic capacitor in parallel with a 1uF ceramic capacitor is recommended for power supply decoupling to ensure stable operation and minimize noise.
The gain setting depends on the specific application requirements. TI recommends using the gain equation provided in the datasheet to calculate the required gain resistors. Additionally, consider the input impedance, output impedance, and desired signal-to-noise ratio when selecting the gain setting.
The maximum power dissipation of the TPA701DGN is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 2.5W at 25°C ambient temperature. However, it's essential to perform thermal calculations and consider heat sinking to ensure reliable operation.
Yes, the TPA701DGN can be used as a line driver. However, it's essential to consider the output impedance, load impedance, and cable capacitance to ensure signal integrity and minimize signal loss. TI recommends using a series resistor and capacitor network to match the output impedance to the load impedance.
To reduce EMI and RFI, TI recommends using proper PCB layout techniques, such as separating analog and digital grounds, using a solid ground plane, and minimizing loop areas. Additionally, consider using EMI filters, shielding, and ferrite beads to reduce radiated emissions.
Trust Checks
This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
TPA701DGN Overview
Use the download button to access the TPA701DGN schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like TPA70,
or try a keyword search, such as Audio/Video Amplifiers
About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
