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TPA731DGNR - Texas Instruments

Description: 700-mW Mono, Differential Input, Class-AB Audio Amplifier with Active High Shutdown

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TPA731DGNR - Texas Instruments - PCB symbol
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PCB Footprints
TPA731DGNR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGN (S-PDSO-G8)(1)
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3D Models
TPA731DGNR - Texas Instruments - 3D model - Small Outline Packages - DGN (S-PDSO-G8)(1)
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TPA731DGNR Details

  • Manufacturer Part Number:

    TPA731DGNR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    AUDIO AMPLIFIER

  • Harmonic Distortion:

    0.5%

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    0.7 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    2.5 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

TPA731DGNR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the TPA731DGNR evaluation module documentation, which includes guidelines for component placement, trace routing, and thermal management to minimize noise and ensure optimal performance.
  • The gain setting depends on the input signal level and the desired output power. TI provides a gain setting calculator tool to help determine the optimal gain setting based on the input signal level and output power requirements.
  • The maximum power dissipation of the TPA731DGNR is dependent on the ambient temperature and the thermal resistance of the PCB. TI provides a thermal design calculator tool to help estimate the maximum power dissipation based on the specific application conditions.
  • The TPA731DGNR has built-in overvoltage protection (OVP) and undervoltage protection (UVP) circuits. Additionally, external voltage regulators and protection circuits can be used to further protect the device from voltage transients and faults.
  • The recommended input coupling capacitor value and type depend on the input signal frequency and amplitude. A general guideline is to use a capacitor with a value between 1uF to 10uF, and a type such as X7R or NP0, which has low equivalent series resistance (ESR) and high reliability.

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TPA731DGNR Overview

Use the download button to access the TPA731DGNR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like TPA73, or try a keyword search, such as Audio/Video Amplifiers

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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