TPCC8131,LQ(S - Toshiba

TPCC8131,LQ(S Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  A thermal pad is recommended under the package to improve thermal performance. A minimum of 2oz copper thickness and a thermal via array under the package is recommended.
• How do I ensure reliable operation across the full temperature range?
  Ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize thermal resistance. Also, consider using a thermal interface material (TIM) to improve heat transfer.
• What are the ESD protection requirements for this device?
  The TPCC8131, LQ has built-in ESD protection, but it is still recommended to follow standard ESD handling procedures during assembly and testing. A minimum of 2kV HBM and 100V MM protection is recommended.
• Can I use this device in a high-reliability application?
  Yes, the TPCC8131, LQ is suitable for high-reliability applications. However, it is recommended to follow Toshiba's reliability guidelines and perform thorough testing and validation to ensure the device meets the specific application requirements.
• What are the recommended soldering conditions for this device?
  The recommended soldering conditions are: peak temperature 260°C, time above 217°C 30s, and time above 200°C 60s. It is also recommended to use a soldering iron with a temperature control system.