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TPD12S015YFFR - Texas Instruments

Description: HDMI Companion Chip with Step-up Converter, I2C Level Shifter, and High-speed ESD Clamps

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TPD12S015YFFR - Texas Instruments - PCB symbol
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PCB Footprints
TPD12S015YFFR - Texas Instruments PCB footprint - BGA - BGA - YFF(R-XBGA-N28)
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3D Models
TPD12S015YFFR - Texas Instruments - 3D model - BGA - YFF(R-XBGA-N28)
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TPD12S015YFFR Details

  • Manufacturer Part Number:

    TPD12S015YFFR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Pin Count:

    28

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    3.6 V

  • Input Voltage-Min:

    1.1 V

  • JESD-30 Code:

    R-XBGA-B28

  • JESD-609 Code:

    e1

  • Length:

    2.76 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.1 A

  • Output Voltage-Max:

    5.3 V

  • Output Voltage-Min:

    4.8 V

  • Output Voltage-Nom:

    5 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA28,4X7,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.625 mm

  • Supply Current-Max (Isup):

    0.0003 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.3 V

  • Surface Mount:

    YES

  • Switcher Configuration:

    BOOST

  • Switching Frequency-Max:

    3500 kHz

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.56 mm

TPD12S015YFFR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the application note SLVAE04, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • Follow the recommended soldering profile and guidelines provided in the Texas Instruments document 'QFN/SON Package Soldering Guidelines' (SLUA271). Ensure the PCB is designed with a solder mask and a thermal relief pattern to facilitate proper solder flow and heat dissipation.
  • While the datasheet specifies an operating temperature range of -40°C to 125°C, it's essential to consider the device's power dissipation and thermal management when operating at high temperatures. Ensure the device is properly heatsinked and follow the thermal design guidelines to prevent overheating.
  • Yes, the TPD12S015YFFR is designed to withstand vibrations and shocks. However, it's crucial to follow proper PCB design and assembly guidelines, including securing the device with a suitable adhesive or mechanical fastening, to ensure reliable operation in high-vibration environments.
  • Start by reviewing the datasheet and application notes to ensure proper device operation and configuration. Use oscilloscopes and logic analyzers to debug the system and identify potential issues. If the problem persists, contact Texas Instruments' technical support for further assistance and potential failure analysis.

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TPD12S015YFFR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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