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TPD4S009DBVRG4 - Texas Instruments

Description: ESD Suppressors / TVS Diodes 4 Ch Display/HDMI Port ESD Protection

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TPD4S009DBVRG4 - Texas Instruments - PCB symbol
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PCB Footprints
TPD4S009DBVRG4 - Texas Instruments PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - DBV0006A HEIGHT 1.45
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TPD4S009DBVRG4 - Texas Instruments - 3D model - SOT23 (6-Pin) - DBV0006A HEIGHT 1.45
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TPD4S009DBVRG4 Details

  • Manufacturer Part Number:

    TPD4S009DBVRG4

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    6

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    LOW CAPACITANCE

  • Breakdown Voltage-Min:

    9 V

  • Clamping Voltage-Max:

    20 V

  • Configuration:

    SINGLE, 4 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • Forward Voltage-Max (VF):

    0.95 V

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    25 W

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Reference Standard:

    IEC-61000-4-2, 4-5

  • Rep Pk Reverse Voltage-Max:

    5.5 V

  • Reverse Current-Max:

    0.1 µA

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

TPD4S009DBVRG4 Frequently Asked Questions (FAQs)

  • A good PCB layout for TPD4S009DBVRG4 involves keeping the input and output traces short and wide, using a solid ground plane, and placing the device close to the connector to minimize EMI. TI provides a recommended layout in the application note SLVAE04.
  • To ensure proper power and bypassing, connect a 0.1uF ceramic capacitor between VCC and GND, and a 10uF electrolytic capacitor between VCC and GND. Place the capacitors close to the device and use short traces to minimize inductance.
  • The maximum cable length supported by TPD4S009DBVRG4 depends on the specific application and signal frequency. As a general guideline, TI recommends keeping cable lengths under 3 meters for optimal performance.
  • To troubleshoot issues with TPD4S009DBVRG4, use a combination of oscilloscope measurements, signal integrity analysis tools, and EMI scanners. TI also provides application notes and technical support resources to help diagnose and resolve common issues.
  • Yes, TPD4S009DBVRG4 has a maximum junction temperature of 150°C. Ensure good airflow around the device, and consider using a heat sink or thermal pad if the device is expected to operate in high-temperature environments.

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TPD4S009DBVRG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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