Part Image

TPH14006NH,L1Q - Toshiba

Description: MOSFET U-MOSVIII-H 60V 34A 16nC MOSFET

Download TPH14006NH,L1Q Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
TPH14006NH,L1Q - Toshiba PCB footprint - Other - Other - SOP ADVANCE
click to zoom
3D Models
TPH14006NH,L1Q - Toshiba  - 3D model - Other - SOP ADVANCE
click to zoom

TPH14006NH,L1Q Details

  • Manufacturer Part Number:

    TPH14006NH,L1Q

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • Avalanche Energy Rating (Eas):

    53 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    14 A

  • Drain-source On Resistance-Max:

    0.033 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    55 pF

  • JESD-30 Code:

    S-PDSO-F8

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    32 W

  • Pulsed Drain Current-Max (IDM):

    42 A

  • Surface Mount:

    YES

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

TPH14006NH,L1Q Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or a heat sink to dissipate heat efficiently.
  • Monitor the device's voltage, current, and temperature to ensure they are within the specified limits. Use a thermal management system to prevent overheating, and implement overcurrent protection to prevent damage.
  • A 10uF to 22uF X7R or X5R ceramic capacitor is recommended for input decoupling. The capacitor should be placed as close to the device as possible to minimize noise and ripple.
  • Check the input voltage, output voltage, and output current to ensure they are within the specified limits. Verify that the device is properly configured and that the output capacitor is of the correct value and type.
  • The device has built-in overcurrent protection, which will limit the output current to prevent damage. The device will automatically recover once the short-circuit condition is removed.

Trust Checks

This model has been provided by an expert contributor.
Expert Contribution
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

TPH14006NH,L1Q Overview

Use the download button to access the TPH14006NH,L1Q schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like TPH14, or try a keyword search, such as Power Field-Effect Transistors

Parts related to TPH14006NH,L1Q

Showing 0 results