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TPH3R70APL,L1Q - Toshiba

Description: MOSFET X35 Pb-F POWER MOSFET TRANSISTOR TSON-ADV PD=170W F=1MHZ

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TPH3R70APL,L1Q - Toshiba - PCB symbol
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PCB Footprints
TPH3R70APL,L1Q - Toshiba PCB footprint - Other - Other - 2-5Q1S
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TPH3R70APL,L1Q - Toshiba - 3D model - Other - 2-5Q1S
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TPH3R70APL,L1Q Details

  • Manufacturer Part Number:

    TPH3R70APL,L1Q

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    7

  • Avalanche Energy Rating (Eas):

    150 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    90 A

  • Drain-source On Resistance-Max:

    0.0037 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    59 pF

  • JESD-30 Code:

    S-PDSO-F8

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    170 W

  • Pulsed Drain Current-Max (IDM):

    500 A

  • Surface Mount:

    YES

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

TPH3R70APL,L1Q Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are also recommended.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout guidelines. Also, consider derating the device's power dissipation at high temperatures.
  • Handle the device with an anti-static wrist strap or mat, and store it in an anti-static bag. The device has built-in ESD protection, but it's still important to follow proper handling procedures to prevent damage.
  • Yes, the TPH3R70APL,L1Q is qualified for automotive and high-reliability applications. However, additional testing and validation may be required to meet specific industry standards.
  • Follow the recommended soldering profile: peak temperature 260°C, time above 217°C 60s max, and 3°C/s max temperature gradient. Use a solder with a melting point above 217°C.

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TPH3R70APL,L1Q Overview

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