Toshiba recommends a PCB layout with a thermal pad connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a heat sink.
To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature. Toshiba also recommends derating the device's power dissipation according to the ambient temperature.
The maximum allowable voltage stress on the TPH4R606NH is 1.5 times the rated voltage (Vr) for a maximum duration of 100ms. Exceeding this limit may cause permanent damage to the device.
To protect the TPH4R606NH from ESD, handle the device with anti-static precautions, such as using an anti-static wrist strap or mat. Ensure that the device is stored in an anti-static package, and avoid touching the device's pins or leads during handling.
Toshiba recommends a soldering profile with a peak temperature of 260°C (500°F) for a maximum of 10 seconds. The device should be soldered using a solder with a melting point of 217°C (423°F) or higher.
Trust Checks
No trust score is available for this model.
Trust Score Unavailable
Sponsored
TPH4R606NH Overview
Use the download button to access the TPH4R606NH 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like TPH4R,
or try a keyword search, such as Power Field-Effect Transistors
