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TPHR8504PL,L1Q - Toshiba

Description: MOSFET 40 Volt N-Channel

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TPHR8504PL,L1Q - Toshiba - PCB symbol
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PCB Footprints
TPHR8504PL,L1Q - Toshiba PCB footprint - Other - Other - 2-5Q1S SOP Advance
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3D Models
TPHR8504PL,L1Q - Toshiba - 3D model - Other - 2-5Q1S SOP Advance
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TPHR8504PL,L1Q Details

  • Manufacturer Part Number:

    TPHR8504PL,L1Q

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    7

  • Avalanche Energy Rating (Eas):

    336 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    150 A

  • Drain-source On Resistance-Max:

    0.0014 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    58 pF

  • JESD-30 Code:

    S-PDSO-F5

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    170 W

  • Pulsed Drain Current-Max (IDM):

    500 A

  • Surface Mount:

    YES

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

TPHR8504PL,L1Q Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or a heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power dissipation according to the temperature derating curve in the datasheet.
  • Handle the device by the body, not the leads. Avoid bending or twisting the leads. Store the device in a dry, cool place, away from direct sunlight and moisture. Use anti-static packaging and follow ESD precautions.
  • Yes, but ensure you follow the recommended design and manufacturing guidelines for high-reliability or automotive applications. Additionally, consult with Toshiba's application engineers for specific guidance and qualification requirements.
  • Consult the datasheet and application notes for troubleshooting guidelines. Check for proper PCB layout, thermal management, and power supply quality. Use oscilloscopes and other diagnostic tools to identify the root cause of the issue.

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TPHR8504PL,L1Q Overview

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