- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for TPN2R304PL,L1Q
- Part Number TPN2R304PL,L1Q
- Manufacturer Toshiba
- Pin Count 9
- Part Category MOSFET (N-Channel)
- Package Category Other
- Footprint Name Other - 2-3X1S
- Released Date Jan 3, 2020
- Last Modified Date Nov 15, 2024 11:55 AM UTC
- Pinout / Pin List Click Here (Member Only)
TPN2R304PL,L1Q Details
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Manufacturer Part Number:
TPN2R304PL,L1Q
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Pbfree Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
TSON-8
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ECCN Code:
EAR99
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Factory Lead Time:
16 Weeks
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Manufacturer:
Toshiba America Electronic Components
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YTEOL:
7
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Avalanche Energy Rating (Eas):
39 mJ
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Case Connection:
DRAIN
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Configuration:
SINGLE WITH BUILT-IN DIODE
TPN2R304PL,L1Q Frequently Asked Questions (FAQs)
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The recommended land pattern for the TPN2R304PL,L1Q is a rectangle with a size of 2.5mm x 1.6mm, with a thermal pad in the center. The land pattern should be designed to ensure good thermal conductivity and to prevent thermal stress on the device.
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To ensure the reliability of the TPN2R304PL,L1Q in high-temperature applications, it is recommended to follow the derating guidelines provided in the datasheet. Additionally, the device should be operated within the recommended operating temperature range, and the PCB should be designed to minimize thermal stress and ensure good thermal conductivity.
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The maximum allowable power dissipation for the TPN2R304PL,L1Q is 2.5W. However, the actual power dissipation may vary depending on the operating conditions and the thermal design of the PCB.
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Yes, the TPN2R304PL,L1Q can be used in high-frequency applications up to 1GHz. However, the device's performance may degrade at higher frequencies, and additional design considerations may be necessary to ensure optimal performance.
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The thermal pad of the TPN2R304PL,L1Q should be connected to a thermal land on the PCB to ensure good thermal conductivity. The thermal land should be designed to minimize thermal resistance and ensure good heat dissipation.
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TPN2R304PL,L1Q Overview
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