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TPS22921YFPR - Texas Instruments

Description: 3.6V, 2A, 16mΩ Load Switch

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PCB Footprints
TPS22921YFPR - Texas Instruments PCB footprint - BGA - BGA - YFP0006 DSBGA - 0.5 mm max height
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3D Models
TPS22921YFPR - Texas Instruments  - 3D model - BGA - YFP0006 DSBGA - 0.5 mm max height
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TPS22921YFPR Details

  • Manufacturer Part Number:

    TPS22921YFPR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Pin Count:

    6

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    Load switch

  • Input Voltage-Max:

    3.6 V

  • Input Voltage-Min:

    0.9 V

  • JESD-30 Code:

    R-XBGA-B6

  • JESD-609 Code:

    e1

  • Length:

    1.17 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA6,2X3,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.5 mm

  • Supply Current-Max (Isup):

    0.00088 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    0.9 V

  • Supply Voltage-Nom (Vsup):

    1 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    0.77 mm

TPS22921YFPR Frequently Asked Questions (FAQs)

  • A good PCB layout for the TPS22921YFPR involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the traces between the device and the capacitors. Additionally, it's recommended to use a shielded inductor and to keep the device away from high-frequency signals.
  • To ensure the TPS22921YFPR is properly configured, you should carefully review the datasheet and application notes, and consider factors such as input voltage, output voltage, output current, and switching frequency. You may also want to consult with a Texas Instruments application engineer or use online design tools and calculators to help with the design process.
  • The TPS22921YFPR has a maximum junction temperature of 150°C. To ensure it doesn't overheat, you should provide adequate heat sinking, such as a thermal pad or heat sink, and ensure good airflow around the device. You should also follow proper PCB design guidelines to minimize thermal resistance and ensure efficient heat dissipation.
  • Yes, the TPS22921YFPR is designed to meet the requirements of high-reliability and safety-critical applications. It has been qualified to various industry standards, including AEC-Q100 and IEC 61508. However, you should carefully review the device's specifications and certifications to ensure it meets the specific requirements of your application.
  • To troubleshoot issues with the TPS22921YFPR, you should first review the datasheet and application notes to ensure proper configuration and layout. You can also use oscilloscopes and other diagnostic tools to identify the root cause of the issue. Additionally, you may want to consult with a Texas Instruments application engineer or seek guidance from online forums and communities.

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TPS22921YFPR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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