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TPS22922BYFPR - Texas Instruments

Description: 3.6V, 2A, 16mΩ Load Switch with Quick Output Discharge

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PCB Footprints
TPS22922BYFPR - Texas Instruments PCB footprint - Other - Other - BGA6C40P2X3_117X77X50
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3D Models
TPS22922BYFPR - Texas Instruments  - 3D model - Other - BGA6C40P2X3_117X77X50
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TPS22922BYFPR Details

  • Manufacturer Part Number:

    TPS22922BYFPR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Pin Count:

    6

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    Load switch

  • Input Voltage-Max:

    3.6 V

  • Input Voltage-Min:

    0.9 V

  • JESD-30 Code:

    R-XBGA-B6

  • JESD-609 Code:

    e1

  • Length:

    1.17 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA6,2X3,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.5 mm

  • Supply Current-Max (Isup):

    0.09 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    0.9 V

  • Supply Voltage-Nom (Vsup):

    1 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    0.77 mm

TPS22922BYFPR Frequently Asked Questions (FAQs)

  • A good PCB layout for the TPS22922BYFPR involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the traces between the device and the capacitors. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper power-up and configuration of the TPS22922BYFPR, follow these steps: 1) Apply power to the VIN pin, 2) Wait for the internal voltage regulator to stabilize (typically <10ms), 3) Configure the device using the EN, SEL, and RST pins, and 4) Verify the device is functioning correctly by monitoring the output voltage and current.
  • The TPS22922BYFPR has a maximum junction temperature of 150°C. To ensure reliable operation, it's essential to provide adequate heat sinking and airflow. A thermal pad on the bottom of the package helps to dissipate heat. Additionally, consider using a thermal interface material and a heat sink to further reduce the thermal resistance.
  • To troubleshoot issues with the TPS22922BYFPR, follow these steps: 1) Verify the input voltage and current, 2) Check the output voltage and current, 3) Verify the configuration pins (EN, SEL, RST) are properly set, 4) Check for overheating, and 5) Consult the datasheet and application notes for guidance on specific error conditions.
  • The TPS22922BYFPR has built-in ESD protection, but it's still essential to follow proper ESD handling procedures during manufacturing and assembly. Use ESD-safe materials, handle the device by the body or pins, and avoid touching the pins or leads. Additionally, consider adding external ESD protection devices if the application requires it.

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TPS22922BYFPR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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