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TPS2376DDA-HG4 - Texas Instruments

Description: IEEE 802.3af PoE HIGH POWER PD CONTROLLER

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TPS2376DDA-HG4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DDA (R-PDSO-G8)_1
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TPS2376DDA-HG4 - Texas Instruments  - 3D model - Small Outline Packages - DDA (R-PDSO-G8)_1
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TPS2376DDA-HG4 Details

  • Manufacturer Part Number:

    TPS2376DDA-HG4

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    PoE POWERED DEVICE CONTROLLER

  • Input Voltage-Max:

    57 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.89 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLSOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.68 mm

  • Supply Current-Max (Isup):

    0.6 mA

  • Supply Voltage-Max (Vsup):

    57 V

  • Supply Voltage-Nom (Vsup):

    48 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

TPS2376DDA-HG4 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's also recommended to follow general high-frequency PCB design guidelines, such as keeping the power traces short and wide, using a solid ground plane, and placing the input and output capacitors close to the device.
  • The selection of input and output capacitors depends on the specific application requirements, such as the input voltage range, output voltage, and ripple current. TI recommends using low-ESR capacitors with a minimum capacitance of 10uF for the input and output. Additionally, the capacitor's voltage rating should be higher than the maximum input or output voltage.
  • The TPS2376DDA-HG4 has an operating junction temperature range of -40°C to 125°C, but the maximum ambient temperature range depends on the specific application and the thermal design of the system. TI recommends following the thermal design guidelines in the datasheet to ensure the device operates within the specified temperature range.
  • The TPS2376DDA-HG4 has a built-in OVP feature that can be enabled by connecting the OVP pin to a voltage source. The OVP threshold is set by the voltage on the OVP pin, and the device will shut down if the input voltage exceeds this threshold. TI recommends following the OVP implementation guidelines in the datasheet to ensure proper operation.
  • The recommended input voltage range for the TPS2376DDA-HG4 is 36V to 60V, but the device can operate with input voltages up to 65V. However, the device's performance and efficiency may be affected at higher input voltages, and TI recommends following the input voltage range guidelines in the datasheet to ensure optimal operation.

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TPS2376DDA-HG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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