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TPS2376DDAR-H - Texas Instruments

Description: Power Switch ICs - POE / LAN IEEE 802.3af PoE Hi Pwr PD CONTROLLER

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TPS2376DDAR-H - Texas Instruments - PCB symbol
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PCB Footprints
TPS2376DDAR-H - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DDA (R-PDSO-G8)_1
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3D Models
TPS2376DDAR-H - Texas Instruments - 3D model - Small Outline Packages - DDA (R-PDSO-G8)_1
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TPS2376DDAR-H Details

  • Manufacturer Part Number:

    TPS2376DDAR-H

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    PoE POWERED DEVICE CONTROLLER

  • Input Voltage-Max:

    57 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.89 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLSOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.68 mm

  • Supply Current-Max (Isup):

    0.6 mA

  • Supply Voltage-Max (Vsup):

    57 V

  • Supply Voltage-Nom (Vsup):

    48 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

TPS2376DDAR-H Frequently Asked Questions (FAQs)

  • A good PCB layout for the TPS2376DDAR-H involves placing the input capacitors close to the VIN pin, using a solid ground plane, and keeping the high-current paths short and wide. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • The input capacitor should be a low-ESR ceramic capacitor with a value of at least 10uF. The capacitor should be rated for the maximum input voltage and should be placed as close to the VIN pin as possible.
  • The maximum ambient temperature range for the TPS2376DDAR-H is -40°C to 85°C. However, the device can operate at a higher temperature range with derating.
  • Proper thermal management involves providing a good thermal path from the device to a heat sink or a metal plate. The device should be mounted on a PCB with a good thermal conductivity, and a thermal interface material should be used to fill any air gaps.
  • The recommended input voltage range for the TPS2376DDAR-H is 7V to 28V. However, the device can operate with an input voltage as low as 5V with reduced performance.

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TPS2376DDAR-H Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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