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TPS63805YFFR - Texas Instruments

Description: 2-A, High-Efficient Buck-Boost Converter with Small Solution Size

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PCB Footprints
TPS63805YFFR - Texas Instruments PCB footprint - BGA - BGA - YFF0015
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TPS63805YFFR - Texas Instruments  - 3D model - BGA - YFF0015
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TPS63805YFFR Details

  • Manufacturer Part Number:

    TPS63805YFFR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2018-10-21

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    PFM CONROL ALSO POSSIBLE

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    1.3 V

  • Input Voltage-Nom:

    3.6 V

  • JESD-30 Code:

    R-XBGA-B15

  • JESD-609 Code:

    e1

  • Length:

    2.255 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    15

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    2 A

  • Output Voltage-Max:

    5.2 V

  • Output Voltage-Min:

    1.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA15,3X5,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.625 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    3100 kHz

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.344 mm

TPS63805YFFR Frequently Asked Questions (FAQs)

  • A good PCB layout for the TPS63805YFFR involves placing the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the input and output traces. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • Choose input capacitors with a voltage rating of at least 1.5 times the maximum input voltage, and output capacitors with a voltage rating of at least 1.5 times the maximum output voltage. X5R or X7R ceramic capacitors are recommended for their low ESR and high reliability.
  • The TPS63805YFFR can operate in an ambient temperature range of -40°C to 125°C. However, the device's performance and reliability may degrade at extreme temperatures, so it's recommended to operate within a range of -20°C to 85°C for optimal performance.
  • To ensure stability, make sure the input and output capacitors are properly selected, and the PCB layout is optimized for minimal inductance and resistance. Additionally, ensure that the output voltage is within the recommended range, and the device is not operated in a region of low output current.
  • Yes, the TPS63805YFFR is a high-reliability device that meets the requirements of AEC-Q100, making it suitable for automotive and other high-reliability applications. However, it's essential to follow proper design and manufacturing guidelines to ensure the device operates within its recommended specifications.

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TPS63805YFFR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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