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TPS65070RSLR - Texas Instruments

Description: Power Management IC (PMIC) with Battery Charger, 3 Step-down converters, and 2 LDOs

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TPS65070RSLR - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RSL (S-PVQFN-N48)
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TPS65070RSLR - Texas Instruments  - 3D model - Quad Flat No-Lead - RSL (S-PVQFN-N48)
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TPS65070RSLR Details

  • Manufacturer Part Number:

    TPS65070RSLR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Pin Count:

    48

  • Country Of Origin:

    Malaysia, Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    INTEGRATED POWER MANAGEMENT UNIT

  • Input Voltage-Max:

    6.3 V

  • Input Voltage-Min:

    1.8 V

  • JESD-30 Code:

    S-PQCC-N48

  • JESD-609 Code:

    e4

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    5

  • Number of Functions:

    1

  • Number of Outputs:

    5

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    1.5 A

  • Output Voltage-Max:

    19.2 V

  • Output Voltage-Min:

    0.725 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC48,.24SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    17 V

  • Supply Voltage-Min (Vsup):

    4.3 V

  • Surface Mount:

    YES

  • Switching Frequency-Max:

    2250 kHz

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Threshold Voltage-Nom:

    +3V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6 mm

TPS65070RSLR Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the TPS65070RSLR involves placing the device close to the battery, using a solid ground plane, and keeping the input and output capacitors close to the device. A 4-layer PCB with a solid ground plane is recommended. Refer to the TI application note 'TPS65070RSLR Layout and Placement Guidelines' for more information.
  • To optimize the TPS65070RSLR for low quiescent current, ensure that the EN pin is driven high or low correctly, use a low-IQ mode, and minimize the number of active regulators. Additionally, use a low-dropout linear regulator (LDO) for the always-on domain, and consider using a low-power mode for the device.
  • The TPS65070RSLR has a thermal pad that must be connected to a solid ground plane to ensure proper heat dissipation. The device can operate up to 105°C, but the junction temperature should be kept below 125°C. A thermal analysis should be performed to ensure the device operates within the recommended temperature range.
  • To troubleshoot issues with the TPS65070RSLR, start by checking the input voltage, output voltage, and enable pin. Verify that the device is properly configured and that the input and output capacitors are correctly sized. Use an oscilloscope to check for voltage rails, and consult the TI troubleshooting guide for the TPS65070RSLR.
  • The TPS65070RSLR is designed to meet EMI and EMC standards, but proper PCB layout and design are crucial to minimize emissions. Use a solid ground plane, keep the input and output capacitors close to the device, and consider using EMI filters or shielding to minimize emissions.

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TPS65070RSLR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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