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TPS82740BSIPR - Texas Instruments

Description: 200-mA Step Down Converter Module with 360nA Iq

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TPS82740BSIPR - Texas Instruments - PCB symbol
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PCB Footprints
TPS82740BSIPR - Texas Instruments PCB footprint - Other - Other - SIP0009F
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3D Models
TPS82740BSIPR - Texas Instruments - 3D model - Other - SIP0009F
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TPS82740BSIPR Details

  • Manufacturer Part Number:

    TPS82740BSIPR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    ALSO OPERATES IN PFM CONTROL TECHNIQUE, ALSO OPERATES IN ADJUSTABLE MODE FROM 1.8 TO 2.5V

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.2 V

  • Input Voltage-Nom:

    3.6 V

  • JESD-30 Code:

    R-PBGA-B9

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    9

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.2 A

  • Output Voltage-Max:

    3.3 V

  • Output Voltage-Min:

    2.6 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    1200 kHz

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Gold (Ni/Au)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.3 mm

TPS82740BSIPR Frequently Asked Questions (FAQs)

  • A good PCB layout for the TPS82740BSIPR involves placing the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the input and output traces. TI provides a recommended PCB layout in the datasheet and application notes.
  • The choice of input and output capacitors depends on the specific application requirements. TI recommends using low-ESR capacitors with a minimum capacitance of 10uF for the input and output. The datasheet provides more information on capacitor selection.
  • The TPS82740BSIPR is rated for operation from -40°C to 125°C. However, the device's performance and reliability may degrade at extreme temperatures. It's essential to consider the thermal design and heat dissipation in the system.
  • The TPS82740BSIPR is a surface-mount device and can be sensitive to vibration and shock. TI recommends following proper mounting and soldering techniques to ensure the device's reliability in harsh environments.
  • To troubleshoot issues with the TPS82740BSIPR, start by verifying the input voltage, output voltage, and current consumption. Check the PCB layout, component selection, and soldering quality. Consult the datasheet, application notes, and TI's support resources for guidance.

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TPS82740BSIPR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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