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TPS92515DGQR - Texas Instruments

Description: 2A LED driver with integrated NFET, high-side current sense, and shunt PWM dimming capable

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TPS92515DGQR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGQ (S-PDSO-G10)_1
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TPS92515DGQR - Texas Instruments  - 3D model - Small Outline Packages - DGQ (S-PDSO-G10)_1
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TPS92515DGQR Details

  • Manufacturer Part Number:

    TPS92515DGQR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HVSSOP-10

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2016-05-05

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Data Input Mode:

    SERIAL

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    2

  • Multiplexed Display Capability:

    NO

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Segments:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    1.5 mA

  • Supply Voltage-Max:

    42 V

  • Supply Voltage-Min:

    5.5 V

  • Supply Voltage-Nom:

    40 V

  • Supply Voltage1-Max:

    42 V

  • Supply Voltage1-Min:

    5.5 V

  • Supply Voltage1-Nom:

    40 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

  • fmax-Min:

    2 MHz

TPS92515DGQR Frequently Asked Questions (FAQs)

  • A good PCB layout for the TPS92515DGQR should prioritize thermal dissipation. Place the device near a thermal pad or a heat sink, and ensure that the thermal pad is connected to a solid ground plane. Use a 2-layer or 4-layer PCB with a thermal relief pattern to improve heat dissipation. Avoid routing high-current traces near the device to minimize thermal resistance.
  • When selecting an inductor for the TPS92515DGQR, consider the inductor's saturation current, DC resistance, and core material. Choose an inductor with a saturation current rating higher than the peak current of the converter. A lower DC resistance reduces energy losses, and a ferrite or iron powder core is recommended for high-frequency operation.
  • For the TPS92515DGQR, use a low-ESR ceramic or film capacitor with a value between 4.7 μF to 10 μF. This ensures stable input voltage and reduces noise. A higher capacitance value can be used for higher input voltage or higher output current applications.
  • To optimize the compensation network for the TPS92515DGQR, use the datasheet's recommended compensation components and adjust them based on the specific application. Start with the recommended values and then fine-tune the compensation network by adjusting the resistors and capacitors to achieve the desired loop gain and phase margin.
  • The maximum ambient temperature for the TPS92515DGQR is 85°C. However, the device's junction temperature (TJ) should not exceed 150°C. Ensure proper thermal design and heat dissipation to maintain a safe operating temperature.

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TPS92515DGQR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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