SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel):
260
Screening Level:
AEC-Q100
Seated Height-Max:
1.2 mm
Supply Voltage-Max:
40 V
Supply Voltage-Min:
4.5 V
Supply Voltage-Nom:
12 V
Surface Mount:
YES
Temperature Grade:
AUTOMOTIVE
Terminal Finish:
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Width:
4.4 mm
TPS92633QPWPRQ1 Frequently Asked Questions (FAQs)
A good PCB layout for the TPS92633QPWPRQ1 should prioritize thermal dissipation. Place the device near a thermal pad or a heat sink, and ensure that the thermal pad is connected to a solid ground plane. Use wide, short traces for the input and output connections to minimize resistance and inductance. Keep the switching node (SW) away from sensitive analog nodes to minimize EMI.
When selecting an inductor for the TPS92633QPWPRQ1, consider the following factors: inductance value, DC resistance, and saturation current. A higher inductance value can reduce the switching frequency, but may increase the size of the inductor. Choose an inductor with a low DC resistance to minimize power loss. Ensure the inductor's saturation current is higher than the peak current of the converter.
For the TPS92633QPWPRQ1, use a low-ESR ceramic or film capacitor with a value between 4.7 μF to 10 μF. This will help filter the input voltage and reduce ripple. A higher capacitance value can improve the input voltage filtering, but may increase the startup time.
To optimize the compensation network for the TPS92633QPWPRQ1, use the following steps: 1) Choose a compensation capacitor (CC) value between 10 pF to 100 pF. 2) Select a compensation resistor (RC) value based on the desired bandwidth and phase margin. 3) Use a simulator or a network analyzer to fine-tune the compensation network for optimal stability and transient response.
When designing for thermal performance with the TPS92633QPWPRQ1, consider the following: 1) Ensure good airflow around the device. 2) Use a heat sink or thermal pad to dissipate heat. 3) Keep the device away from other heat sources. 4) Monitor the junction temperature (TJ) to prevent overheating. 5) Use thermal interface materials (TIMs) to improve heat transfer.
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TPS92633QPWPRQ1 Overview
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.