FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel):
260
Screening Level:
AEC-Q100
Seated Height-Max:
1.2 mm
Supply Voltage-Max:
60 V
Supply Voltage-Min:
4.5 V
Surface Mount:
YES
Terminal Finish:
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form:
GULL WING
Terminal Pitch:
0.5 mm
Terminal Position:
QUAD
Width:
7 mm
TPS92664QPHPRQ1 Frequently Asked Questions (FAQs)
A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure that the thermal pad is connected to a large copper area to dissipate heat efficiently.
Implement a thermal management system, such as a heat sink or fan, to keep the junction temperature below 125°C. Also, ensure that the device is operated within the recommended operating conditions.
A low-ESR ceramic capacitor (e.g., X5R or X7R) with a value of 10-22 μF is recommended for input decoupling. This helps to filter out noise and ensure stable operation.
Use a shielded inductor, keep the switching node (SW) away from sensitive nodes, and ensure that the PCB layout is optimized for minimal radiation. Additionally, consider adding EMI filters or shielding to the design.
A low-ESR ceramic capacitor (e.g., X5R or X7R) with a value of 10-22 μF is recommended for output filtering. This helps to reduce output ripple and ensure stable operation.
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TPS92664QPHPRQ1 Overview
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
