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TPS9900TPZPQ1 - Texas Instruments

Description: Display Drivers & Controllers DLP® system management and illumination controller for DLP553x-Q1 chipset 100-HTQFP -40 to 105

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TPS9900TPZPQ1 - Texas Instruments - PCB symbol
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TPS9900TPZPQ1 - Texas Instruments PCB footprint - Quad Flat Packages - Quad Flat Packages - PZP (S-PQFP-G100)-
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TPS9900TPZPQ1 Details

  • Manufacturer Part Number:

    TPS9900TPZPQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2018-09-19

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Consumer IC Type:

    CONSUMER CIRCUIT

  • JESD-30 Code:

    S-PQFP-G100

  • JESD-609 Code:

    e4

  • Length:

    14 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    100

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTFQFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

TPS9900TPZPQ1 Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 2-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer to ensure good thermal conductivity. A minimum of 2 oz copper thickness is recommended for the PCB.
  • The input capacitor should be selected based on the input voltage ripple, output voltage, and output current requirements. A minimum of 10uF ceramic capacitor with an X7R or X5R dielectric is recommended. The capacitor should be placed as close as possible to the VIN pin.
  • The TPS9900 can deliver up to 3A of output current, but this is dependent on the input voltage, output voltage, and thermal conditions. It's recommended to derate the output current based on the ambient temperature and thermal design.
  • The TPS9900 has a built-in overcurrent protection feature that can be enabled by connecting a resistor between the OCP pin and the GND pin. The value of the resistor determines the overcurrent threshold. A typical value is 1kΩ for a 3A overcurrent limit.
  • A minimum of 22uF ceramic capacitor with an X7R or X5R dielectric is recommended for the output capacitor. The output capacitor should be placed as close as possible to the VOUT pin and should be rated for the output voltage and ripple current.

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TPS9900TPZPQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image TPS9900TPZPRQ1 Texas Instruments

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