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TPSI3050QDWZRQ1 - Texas Instruments

Description: Isolated Gate Drivers Automotive reinforced isolated switch driver with integrated 10-V gate supply 8-SO-MOD -40 to 125

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TPSI3050QDWZRQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DWZ0008A
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TPSI3050QDWZRQ1 - Texas Instruments  - 3D model - Small Outline Packages - DWZ0008A
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TPSI3050QDWZRQ1 Details

  • Manufacturer Part Number:

    TPSI3050QDWZRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    Gate drive voltage(V) : 10

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    7.5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.45

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.8 mm

  • Supply Current-Max (Isup):

    254 mA

  • Supply Voltage-Max (Vsup):

    48 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +2.55V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5.85 mm

TPSI3050QDWZRQ1 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Monitor the device's junction temperature (TJ) and adjust the design accordingly.
  • Exceeding TJ can lead to reduced lifespan, decreased performance, and potential device failure. Ensure proper thermal design and monitoring to prevent overheating.
  • Yes, but ensure compliance with relevant industry standards (e.g., IEC 61508, ISO 26262) and perform thorough testing and validation. Consult with Texas Instruments' support team for guidance.
  • Check the input voltage, output load, and feedback network. Verify the device is properly configured and the output capacitor is suitable. Consult the datasheet and application notes for guidance.

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TPSI3050QDWZRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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