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TPSM5601R5HSRDAR - Texas Instruments

Description: Power Management Modules 60-V input, 1-V to 16-V output, 1.5-A power module in enhanced HotRod QFN package 15-B3QFN -40 to 125

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PCB Footprints
TPSM5601R5HSRDAR - Texas Instruments PCB footprint - Other - Other - RDA0015A_5X5.5
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TPSM5601R5HSRDAR - Texas Instruments  - 3D model - Other - RDA0015A_5X5.5
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TPSM5601R5HSRDAR Details

  • Manufacturer Part Number:

    TPSM5601R5HSRDAR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    60 V

  • Input Voltage-Min:

    4.2 V

  • Input Voltage-Nom:

    24 V

  • JESD-30 Code:

    R-PXMA-N15

  • JESD-609 Code:

    e4

  • Length:

    5.5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    15

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    1.5 A

  • Output Voltage-Max:

    16 V

  • Output Voltage-Min:

    1 V

  • Output Voltage-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    XMA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Peak Reflow Temperature (Cel):

    245

  • Seated Height-Max:

    4.1 mm

  • Supply Voltage-Nom (Vsup):

    24 V

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    1150 kHz

  • Technology:

    HYBRID

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    UNSPECIFIED

  • Width:

    5 mm

TPSM5601R5HSRDAR Frequently Asked Questions (FAQs)

  • A good PCB layout for the TPSM5601R5HSRDAR should include a solid ground plane, short and wide traces for power and ground, and a decoupling capacitor (e.g., 10uF) placed close to the device. Additionally, the input and output capacitors should be placed close to the device and connected to the respective pins using short traces.
  • To ensure the TPSM5601R5HSRDAR operates within its recommended operating conditions, make sure to provide a stable input voltage within the specified range (4.5V to 5.5V), keep the ambient temperature within the specified range (-40°C to 125°C), and avoid exceeding the maximum current rating (6A).
  • The TPSM5601R5HSRDAR has a thermal pad that must be connected to a solid ground plane to ensure proper heat dissipation. A thermal via or a thermal pad on the PCB can be used to dissipate heat. Additionally, ensure good airflow around the device and avoid blocking the airflow with components or obstacles.
  • Yes, the TPSM5601R5HSRDAR is suitable for high-reliability applications. It is qualified to the Automotive AEC-Q100 standard, which ensures it meets the reliability requirements for automotive applications. The device also has a high MTBF (Mean Time Between Failures) rating, making it suitable for high-reliability applications.
  • To troubleshoot issues with the TPSM5601R5HSRDAR, start by checking the input voltage, output voltage, and current. Verify that the device is operating within its recommended operating conditions. Common failure modes include overheating, overvoltage, and overcurrent. Check for signs of physical damage, such as cracks or burn marks, and ensure the device is properly soldered to the PCB.

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TPSM5601R5HSRDAR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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