Texas Instruments provides a recommended PCB layout in the TPSM86837RCGR datasheet, but it's essential to follow additional guidelines for optimal thermal performance. Ensure a solid copper pour on the top and bottom layers, use thermal vias to connect the pour to the internal layers, and keep the PCB thickness to a minimum (e.g., 0.8 mm).
When selecting an input capacitor, consider the voltage rating, capacitance value, and equivalent series resistance (ESR). A 10 μF to 22 μF ceramic capacitor with an X7R or X5R dielectric and a voltage rating of 25 V or higher is recommended. Ensure the capacitor is placed close to the VIN pin and has a low ESR to minimize voltage ripple.
The TPSM86837RCGR can deliver up to 3.5 A of output current, but this is dependent on the input voltage, output voltage, and thermal conditions. Be sure to check the device's power dissipation and thermal derating to ensure reliable operation.
The TPSM86837RCGR has a built-in overcurrent protection feature that can be enabled by connecting a resistor between the OCP pin and GND. The value of the resistor determines the overcurrent threshold. Consult the datasheet for specific resistor values and implementation guidelines.
The TPSM86837RCGR is rated for operation from -40°C to 125°C (TJ). However, it's essential to consider the device's power dissipation and thermal derating to ensure reliable operation within the specified temperature range.
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
