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TRF372017IRGZT - Texas Instruments

Description: 300 MHz to 4.8GHz Quadrature Modulator with integrated wideband PLL/VCO

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PCB Footprints
TRF372017IRGZT - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - IDT71V124SA10PHG
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3D Models
TRF372017IRGZT - Texas Instruments  - 3D model - Quad Flat No-Lead - IDT71V124SA10PHG
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TRF372017IRGZT Details

  • Manufacturer Part Number:

    TRF372017IRGZT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Pin Count:

    48

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • JESD-30 Code:

    S-PQCC-N48

  • JESD-609 Code:

    e4

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC48,.27SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    0.25 mA

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    RF AND BASEBAND CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

TRF372017IRGZT Frequently Asked Questions (FAQs)

  • For optimal performance, it's recommended to follow Texas Instruments' recommended PCB layout guidelines, including using a solid ground plane, minimizing trace lengths, and using thermal vias to dissipate heat. A thermal pad on the bottom of the package should be connected to a solid copper plane on the PCB to ensure efficient heat dissipation.
  • To ensure signal integrity and minimize EMI emissions, use a multi-layer PCB with a solid ground plane, keep signal traces short and away from the edge of the board, and use shielding or filtering components as needed. Additionally, follow Texas Instruments' recommended layout guidelines and use a common-mode choke or ferrite bead to filter out high-frequency noise.
  • For optimal performance, use a low-ESR capacitor (e.g., 100nF) as close as possible to the TRF372017IRGZT's power pins. Add a 10uF or larger capacitor in parallel to filter out low-frequency noise. Use a ferrite bead or common-mode choke to filter out high-frequency noise on the power supply lines.
  • To optimize the TRF372017IRGZT's performance, consult the device's datasheet and application notes for specific guidance on settings and configurations. Additionally, consider using Texas Instruments' development tools and software, such as the TRF37xx Evaluation Module, to fine-tune the device's performance for your specific application.
  • The TRF372017IRGZT is a high-reliability device with a proven track record in various applications. Texas Instruments provides detailed reliability and quality metrics, including MTBF (Mean Time Between Failures) and FIT (Failures in Time) rates, in the device's datasheet and quality/reliability reports.

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TRF372017IRGZT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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