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TRF6900APT - Texas Instruments

Description: RF Transceiver Hily Integr MultiCh RF Trans

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TRF6900APT - Texas Instruments PCB footprint - Quad Flat Packages - Quad Flat Packages - PT (S-PQFP-G48
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TRF6900APT - Texas Instruments  - 3D model - Quad Flat Packages - PT (S-PQFP-G48
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TRF6900APT Details

  • Manufacturer Part Number:

    TRF6900APT

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFP

  • Package Description:

    LQFP-48

  • Pin Count:

    48

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • JESD-30 Code:

    S-PQFP-G48

  • JESD-609 Code:

    e4

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    70 °C

  • Operating Temperature-Min:

    -20 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP48,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Supply Current-Max:

    0.05 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Telecom IC Type:

    RF AND BASEBAND CIRCUIT

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

TRF6900APT Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the TRF6900APT evaluation module (EVM) user's guide, which includes guidelines for component placement, routing, and grounding to minimize noise and ensure optimal performance.
  • The TRF6900APT can be configured for different frequency bands by adjusting the values of the external components, such as the inductors and capacitors, and by programming the device's registers using the SPI interface. The specific configuration will depend on the desired frequency band and the application requirements.
  • The TRF6900APT is designed to handle a maximum output power of +20 dBm (100 mW) per channel, but the actual power handling capability may be limited by the specific application and the external components used.
  • Impedance matching for the TRF6900APT can be implemented using external components, such as inductors and capacitors, to match the device's output impedance to the load impedance. The specific impedance matching network will depend on the frequency band and the load impedance.
  • The latency of the TRF6900APT is typically in the range of 10-20 ns, depending on the specific configuration and the application requirements. This latency is due to the internal processing and filtering of the device.

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TRF6900APT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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